幾種芯片封裝
讀數據手冊,看到了幾種不同封裝的描述。記錄一下。
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QFP
QFP是指四方扁平式封裝技術(Quad Flat Package),該技術實現的CPU芯片引腳之間距離很小,管腳很細。
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QFP 有多種變種:
- BQFP: Bumpered Quad Flat Package
- BQFPH: Bumpered Quad Flat Package with heat spreader
- CQFP: Ceramic Quad Flat Package
- EQFP: Plastic Enhanced Quad Flat Package
- FQFP: Fine Pitch Quad Flat Package
- LQFP: Low Profile Quad Flat Package
- MQFP: Metric Quad Flat Package
- NQFP: Near chip-scale Quad Flat Package.
- SQFP: Small Quad Flat Package
- TQFP: Thin Quad Flat Package
- VQFP: Very small Quad Flat Package
- VTQFP: Very Thin Quad Flat Package
- TDFP: Thin Dual Flat Package.
LQFP
Low-profile Quad Flat Package 薄型四方扁平封裝
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TQFP
thin quad flat pack 薄QFP
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VFQFPN
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UFQFPN
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