讀數據手冊，看到了幾種不同封裝的描述。記錄一下。

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QFP

QFP是指四方扁平式封裝技術（Quad Flat Package），該技術實現的CPU芯片引腳之間距離很小，管腳很細。

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QFP 有多種變種：

• BQFP: Bumpered Quad Flat Package
• BQFPH: Bumpered Quad Flat Package with heat spreader
• CQFP: Ceramic Quad Flat Package
• EQFP: Plastic Enhanced Quad Flat Package
• FQFP: Fine Pitch Quad Flat Package
• LQFP: Low Profile Quad Flat Package
• MQFP: Metric Quad Flat Package
• NQFP: Near chip-scale Quad Flat Package.
• SQFP: Small Quad Flat Package
• TQFP: Thin Quad Flat Package
• VQFP: Very small Quad Flat Package
• VTQFP: Very Thin Quad Flat Package
• TDFP: Thin Dual Flat Package.

LQFP

Low-profile Quad Flat Package 薄型四方扁平封裝

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TQFP

thin quad flat pack 薄QFP

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VFQFPN

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UFQFPN

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參考wikipedia